HD74HC08RP-E
vs
MM74HC08M
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOP, SOP14,.25
0.150 INCH, MS-012, SOIC-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e6
e3
Length
8.65 mm
8.6235 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
23 ns
35 ns
Propagation Delay (tpd)
115 ns
121 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
1.753 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN BISMUTH
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
5
Manufacturer Package Code
14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
ECCN Code
EAR99
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare HD74HC08RP-E with alternatives
Compare MM74HC08M with alternatives