MM74HC08M vs MM74HC08MX feature comparison

MM74HC08M Fairchild Semiconductor Corporation

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MM74HC08MX Rochester Electronics LLC

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP ROCHESTER ELECTRONICS INC
Part Package Code SOIC SOIC
Package Description 0.150 INCH, MS-012, SOIC-14 SOP,
Pin Count 14 14
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3 e3
Length 8.6235 mm 8.6235 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 35 ns
Propagation Delay (tpd) 121 ns 121 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.753 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 3.9 mm
Base Number Matches 5 5

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