HD74ALVC2G157US
vs
IDT74ALVCH16271PA8
feature comparison
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
VSSOP,
|
TSSOP,
|
Pin Count |
8
|
56
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
ALVC/VCX/A
|
ALVC/VCX/A
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G56
|
Length |
2.3 mm
|
14 mm
|
Logic IC Type |
MULTIPLEXER
|
BUS EXCHANGER
|
Number of Functions |
1
|
12
|
Number of Inputs |
2
|
|
Number of Outputs |
1
|
|
Number of Terminals |
8
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Propagation Delay (tpd) |
11 ns
|
6.2 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
1.2 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
6.1 mm
|
Base Number Matches |
2
|
1
|
Control Type |
|
ENABLE LOW
|
Count Direction |
|
BIDIRECTIONAL
|
JESD-609 Code |
|
e0
|
Max I(ol) |
|
0.024 A
|
Number of Bits |
|
1
|
Number of Ports |
|
3
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
TSSOP56,.3,20
|
Packing Method |
|
TR, 13 INCH
|
Power Supply Current-Max (ICC) |
|
100 mA
|
Prop. Delay@Nom-Sup |
|
6.2 ns
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD74ALVC2G157US with alternatives
Compare IDT74ALVCH16271PA8 with alternatives