HD74ALVC2G157US vs IDT74ALVCH16271PA8 feature comparison

HD74ALVC2G157US Renesas Electronics Corporation

Buy Now Datasheet

IDT74ALVCH16271PA8 Integrated Device Technology Inc

Buy Now Datasheet
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOIC TSSOP
Package Description VSSOP, TSSOP,
Pin Count 8 56
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G8 R-PDSO-G56
Length 2.3 mm 14 mm
Logic IC Type MULTIPLEXER BUS EXCHANGER
Number of Functions 1 12
Number of Inputs 2
Number of Outputs 1
Number of Terminals 8 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 11 ns 6.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.9 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 1.2 V 2.3 V
Supply Voltage-Nom (Vsup) 1.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 6.1 mm
Base Number Matches 2 1
Control Type ENABLE LOW
Count Direction BIDIRECTIONAL
JESD-609 Code e0
Max I(ol) 0.024 A
Number of Bits 1
Number of Ports 3
Output Characteristics 3-STATE
Package Equivalence Code TSSOP56,.3,20
Packing Method TR, 13 INCH
Power Supply Current-Max (ICC) 100 mA
Prop. Delay@Nom-Sup 6.2 ns
Terminal Finish TIN LEAD

Compare HD74ALVC2G157US with alternatives

Compare IDT74ALVCH16271PA8 with alternatives