HD74AC298FP-EL vs 74HC75DB,112 feature comparison

HD74AC298FP-EL Hitachi Ltd

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74HC75DB,112 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATES AT 5V VCC NOMINAL
Family AC HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 6.2 mm
Logic IC Type MULTIPLEXER D LATCH
Number of Functions 4 2
Number of Inputs 2
Number of Outputs 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 11.5 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT338-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 2
Package Equivalence Code SSOP16,.3
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type HIGH LEVEL
fmax-Min 60 MHz

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Compare 74HC75DB,112 with alternatives