HD74AC259RP vs MC74AC259DR2G feature comparison

HD74AC259RP Renesas Electronics Corporation

Buy Now Datasheet

MC74AC259DR2G onsemi

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No
Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code SOIC SOIC 16 LEAD
Package Description SOP, SOIC-16
Pin Count 16 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATES WITH 5V SUPPLY 1:8 DMUX FOLLOWED BY LATCH
Family AC AC
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e3
Length 9.9 mm 9.9 mm
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 12 ns 17 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 3 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL LOW LEVEL
Width 3.95 mm 3.9 mm
fmax-Min 95 MHz
Base Number Matches 4 1
Manufacturer Package Code 751B-05
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Load Capacitance (CL) 50 pF
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 17 ns
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74AC259RP with alternatives

Compare MC74AC259DR2G with alternatives