HD74AC241FP
vs
5962-9220301M2A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
QLCC
|
| Package Description |
SOP, SOP20,.4
|
CERAMIC, LCC-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW/HIGH
|
|
| Family |
AC
|
FCT
|
| JESD-30 Code |
R-PDSO-G20
|
S-CQCC-N20
|
| Length |
12.6 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
10 ns
|
|
| Propagation Delay (tpd) |
10.5 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
1.905 mm
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
5.5 mm
|
8.89 mm
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Screening Level |
|
MIL-STD-883
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD74AC241FP with alternatives
Compare 5962-9220301M2A with alternatives