HD74AC175RP-EL
vs
HD74LS75FP
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
HITACHI LTD
|
HITACHI LTD
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
SOP, SOP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO OPERATES WITH 5V SUPPLY
|
|
Family |
AC
|
LS
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
9.9 mm
|
10.06 mm
|
Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
Number of Functions |
1
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
14.5 ns
|
27 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
HIGH LEVEL
|
Width |
3.95 mm
|
5.5 mm
|
fmax-Min |
187 MHz
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Max I(ol) |
|
0.008 A
|
Moisture Sensitivity Level |
|
1
|
Number of Bits |
|
2
|
Package Equivalence Code |
|
SOP16,.3
|
Peak Reflow Temperature (Cel) |
|
260
|
Power Supply Current-Max (ICC) |
|
12 mA
|
Prop. Delay@Nom-Sup |
|
27 ns
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare HD74AC175RP-EL with alternatives
Compare HD74LS75FP with alternatives