HD74AC138TELL
vs
CD4515BFMSH
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP16,.25
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
4000/14000/40000
|
| Input Conditioning |
STANDARD
|
LATCHED
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T24
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
4-LINE TO 16-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
24
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
15 ns
|
|
| Propagation Delay (tpd) |
15 ns
|
1310 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
ADDRESS LATCHES
|
|
|
|
Compare HD74AC138TELL with alternatives
Compare CD4515BFMSH with alternatives