CD4515BFMSH
vs
HEF4515BP
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
PHILIPS SEMICONDUCTORS
|
Package Description |
,
|
DIP, DIP24,.6
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ADDRESS LATCHES
|
|
Family |
4000/14000/40000
|
|
Input Conditioning |
LATCHED
|
|
JESD-30 Code |
R-GDIP-T24
|
R-PDIP-T24
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
4-LINE TO 16-LINE DECODER
|
OTHER DECODER/DRIVER
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Propagation Delay (tpd) |
1310 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
18 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
Max I(ol) |
|
0.00035999999999999997 A
|
Package Equivalence Code |
|
DIP24,.6
|
Prop. Delay@Nom-Sup |
|
550 ns
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare CD4515BFMSH with alternatives