CD4515BFMSH vs HEF4515BP feature comparison

CD4515BFMSH Intersil Corporation

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HEF4515BP Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer HARRIS SEMICONDUCTOR PHILIPS SEMICONDUCTORS
Package Description , DIP, DIP24,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES
Family 4000/14000/40000
Input Conditioning LATCHED
JESD-30 Code R-GDIP-T24 R-PDIP-T24
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER OTHER DECODER/DRIVER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 1310 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Max I(ol) 0.00035999999999999997 A
Package Equivalence Code DIP24,.6
Prop. Delay@Nom-Sup 550 ns
Terminal Pitch 2.54 mm

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