HD6417751RBP240
vs
XPC850DSLZT50BU
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
HITACHI LTD
|
MOTOROLA INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA,
|
BGA, BGA256,16X16,50
|
Pin Count |
256
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
26
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
34 MHz
|
50 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FLOATING POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
27 mm
|
23 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
75 °C
|
|
Operating Temperature-Min |
-20 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
240 MHz
|
50 MHz
|
Supply Voltage-Max |
1.6 V
|
3.465 V
|
Supply Voltage-Min |
1.35 V
|
3.135 V
|
Supply Voltage-Nom |
1.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
23 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
2
|
4
|
Rohs Code |
|
No
|
Package Equivalence Code |
|
BGA256,16X16,50
|
Seated Height-Max |
|
2.35 mm
|
|
|
|
Compare HD6417751RBP240 with alternatives