HD6417751RBP240 vs MPC852TVR66 feature comparison

HD6417751RBP240 Hitachi Ltd

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MPC852TVR66 Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HITACHI LTD FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, PLASTIC, BGA-256
Pin Count 256 256
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 34 MHz 66 MHz
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 27 mm 23 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 75 °C 95 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 240 MHz 66 MHz
Supply Voltage-Max 1.6 V 1.9 V
Supply Voltage-Min 1.35 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3
Rohs Code Yes
Additional Feature ALSO REQUIRES 3.3V SUPPLY
JESD-609 Code e1
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,50
Peak Reflow Temperature (Cel) 245
Seated Height-Max 2.54 mm
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare HD6417751RBP240 with alternatives

Compare MPC852TVR66 with alternatives