HD6417751RBP240
vs
XPC823EZT66B2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
HITACHI LTD
ROCHESTER ELECTRONICS LLC
Part Package Code
BGA
BGA
Package Description
BGA,
23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
Pin Count
256
256
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
26
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
34 MHz
5 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
27 mm
23 mm
Low Power Mode
YES
YES
Number of Terminals
256
256
Operating Temperature-Max
75 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
COMMERCIAL
Speed
240 MHz
66 MHz
Supply Voltage-Max
1.6 V
3.6 V
Supply Voltage-Min
1.35 V
3 V
Supply Voltage-Nom
1.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
COMMERCIAL EXTENDED
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
23 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
6
Seated Height-Max
2.35 mm
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