HD63485PS64
vs
NS32818V-80X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
SDIP, SDIP64,.75
QCCJ,
Pin Count
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
19
18
Boundary Scan
NO
NO
External Data Bus Width
JESD-30 Code
R-PDIP-T64
S-PQCC-J64
JESD-609 Code
e0
Length
57.6 mm
24.2316 mm
Low Power Mode
NO
NO
Number of Banks
1
4
Number of Terminals
64
64
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SDIP
QCCJ
Package Equivalence Code
SDIP64,.75
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE, SHRINK PITCH
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
160 mA
240 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
BICMOS
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
1.778 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
19.05 mm
24.2316 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
1
2
Clock Frequency-Max
80 MHz
Memory Organization
256K X 1
Compare HD63485PS64 with alternatives
Compare NS32818V-80X with alternatives