HD63485PS64
vs
DP8418V-70
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
|
Package Description |
SDIP, SDIP64,.75
|
QCCJ, LDCC68,1.0SQ
|
Pin Count |
64
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
19
|
18
|
Boundary Scan |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDIP-T64
|
S-PQCC-J64
|
JESD-609 Code |
e0
|
e0
|
Length |
57.6 mm
|
24.2316 mm
|
Low Power Mode |
NO
|
NO
|
Number of Banks |
1
|
4
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
QCCJ
|
Package Equivalence Code |
SDIP64,.75
|
LDCC68,1.0SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE, SHRINK PITCH
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Supply Current-Max |
160 mA
|
240 mA
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BICMOS
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
1.778 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
19.05 mm
|
24.2316 mm
|
uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
Base Number Matches |
1
|
2
|
Clock Frequency-Max |
|
70 MHz
|
Memory Organization |
|
256K X 1
|
|
|
|
Compare HD63485PS64 with alternatives
Compare DP8418V-70 with alternatives