HD61202UFS vs S6B0108 feature comparison

HD61202UFS Hitachi Ltd

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S6B0108 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HITACHI LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code QFP DIE
Package Description QFP, QFP100,.7X1.0 DIE,
Pin Count 100 100
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Display Mode SEGMENT DOT MATRIX
Interface IC Type LIQUID CRYSTAL DISPLAY DRIVER LIQUID CRYSTAL DISPLAY DRIVER
JESD-30 Code R-PQFP-G100 R-XUUC-N100
Length 20 mm
Number of Segments 64 64
Number of Terminals 100 100
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C -30 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code QFP DIE
Package Equivalence Code QFP100,.7X1.0
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.1 mm
Supply Current-Max 0.5 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD UPPER
Width 14 mm
Base Number Matches 1 1
Data Input Mode PARALLEL
Multiplexed Display Capability NO
Number of Functions 1
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Supply Voltage1-Max 17 V
Supply Voltage1-Min 8 V

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