HD407C4359RH
vs
DSPIC33FJ32GP303-E/TPT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
QFP
Package Description
QFP,
10 X 10 MM, 2 MM HEIGHT, LEAD FREE, PLASTIC, QFP-44
Pin Count
44
44
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
4
16
JESD-30 Code
S-PQFP-G44
S-PQFP-G44
Length
14 mm
10 mm
Number of Terminals
44
44
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
TQFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.05 mm
1.2 mm
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
14 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
2
1
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Address Bus Width
Clock Frequency-Max
40 MHz
External Data Bus Width
JESD-609 Code
e3
Moisture Sensitivity Level
3
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
260
ROM Programmability
FLASH
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3.3 V
Temperature Grade
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare HD407C4359RH with alternatives
Compare DSPIC33FJ32GP303-E/TPT with alternatives