HD26LS32AP
vs
MAX3045BEWE+T
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
|
| Part Package Code |
DIP
|
16-SOIC_W-300_MIL
|
| Package Description |
DIP, DIP16,.3
|
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
STANDARD
|
| Interface IC Type |
LINE RECEIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422-A; EIA-423
|
EIA-422; EIA-485
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e3
|
| Length |
19.2 mm
|
10.3 mm
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Low Current-Max |
0.008 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
35 ns
|
|
| Receiver Number of Bits |
4
|
|
| Seated Height-Max |
5.06 mm
|
2.65 mm
|
| Supply Current-Max |
70 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
16-SOIC_W-300_MIL
|
| Date Of Intro |
|
2001-07-15
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Differential Output |
|
YES
|
| Driver Number of Bits |
|
4
|
| Moisture Sensitivity Level |
|
1
|
| Out Swing-Min |
|
1.5 V
|
| Output Characteristics |
|
3-STATE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
CMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transmit Delay-Max |
|
1500 ns
|
|
|
|
Compare HD26LS32AP with alternatives
Compare MAX3045BEWE+T with alternatives