HCTL-2000 vs HCTL-2020 feature comparison

HCTL-2000 Agilent Technologies Inc

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HCTL-2020 Hewlett Packard Co

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer AGILENT TECHNOLOGIES INC HEWLETT PACKARD CO
Part Package Code DIP
Package Description DIP-16 DIP-20
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature SEATED HGT-CALCULATED SEATED-HGT CALCULATED
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDIP-T16 R-PDIP-T20
JESD-609 Code e0 e0
Length 19.05 mm 25.91 mm
Number of Functions 1 1
Number of Terminals 16 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 4.19 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 4

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