HCS410-/P
vs
HCS410/ST
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
4.40 MM, TSSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
1.4 mA
|
3.5 mA
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Telecom IC Type |
DATA ENCRYPTION CIRCUIT
|
DATA ENCRYPTION CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.31.00.01
|
| Length |
|
4.4 mm
|
| Moisture Sensitivity Level |
|
1
|
| Seated Height-Max |
|
1.1 mm
|
| Terminal Pitch |
|
0.65 mm
|
| Width |
|
3 mm
|
|
|
|
Compare HCS410-/P with alternatives
Compare HCS410/ST with alternatives