HCS320-/P
vs
HCS410-I/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, DIP-8
4.40 MM, TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
JESD-609 Code
e3
e3
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
3 V
Surface Mount
NO
YES
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Base Number Matches
1
1
HTS Code
8542.39.00.01
Length
4.4 mm
Moisture Sensitivity Level
1
Seated Height-Max
1.2 mm
Supply Current-Max
3.5 mA
Terminal Pitch
0.65 mm
Width
3 mm
Compare HCS320-/P with alternatives
Compare HCS410-I/ST with alternatives