HCS200/SN
vs
HCS410/ST
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
SOIC
Package Description
0.150 INCH, PLASTIC, SOIC-8
4.40 MM, TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
4.9 mm
4.4 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.1 mm
Supply Voltage-Nom
5 V
3 V
Surface Mount
YES
YES
Telecom IC Type
DATA ENCRYPTION CIRCUIT
DATA ENCRYPTION CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
3.9116 mm
3 mm
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8542.31.00.01
Supply Current-Max
3.5 mA
Compare HCS200/SN with alternatives
Compare HCS410/ST with alternatives