HCS138DTR vs 74HCT238U feature comparison

HCS138DTR Intersil Corporation

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74HCT238U NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Part Package Code DIP WAFER
Package Description DIP, DIP16,.3 DIE,
Pin Count 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
Input Conditioning STANDARD STANDARD
JESD-30 Code R-CDIP-T16 X-XUUC-N
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.006 A
Number of Functions 1 1
Number of Terminals 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity INVERTED TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Prop. Delay@Nom-Sup 34 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class T
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Total Dose 100k Rad(Si) V
Width 7.62 mm
Base Number Matches 1 1
Propagation Delay (tpd) 53 ns

Compare HCS138DTR with alternatives

Compare 74HCT238U with alternatives