HCPL-J784#500
vs
HCPL-7851
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HEWLETT PACKARD CO
HEWLETT PACKARD CO
Part Package Code
SOIC
DIP
Package Description
SOP,
,
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
100 MHz
100 MHz
Common Mode Voltage-Max
3750 V
Isolation Voltage-Min
3750 V
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.56
8.4
Voltage Gain-Min
7.44
7.6
Base Number Matches
4
4
Compare HCPL-J784#500 with alternatives
Compare HCPL-7851 with alternatives