HCPL-J784#500 vs HCPL-7851 feature comparison

HCPL-J784#500 Hewlett Packard Co

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HCPL-7851 Hewlett Packard Co

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HEWLETT PACKARD CO HEWLETT PACKARD CO
Part Package Code SOIC DIP
Package Description SOP, ,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 100 MHz 100 MHz
Common Mode Voltage-Max 3750 V
Isolation Voltage-Min 3750 V
JESD-30 Code R-PDSO-G8 R-PDIP-T8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 5.5 V 5.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Position DUAL DUAL
Voltage Gain-Max 8.56 8.4
Voltage Gain-Min 7.44 7.6
Base Number Matches 4 4

Compare HCPL-J784#500 with alternatives

Compare HCPL-7851 with alternatives