HCPL-J454
vs
SFH6135
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
300 MIL, WHITE MOLD, DIP-8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED, VDE APPROVED, TTL COMPATIBLE
|
|
| Configuration |
SINGLE
|
|
| Forward Current-Max |
0.025 A
|
0.025 A
|
| Isolation Voltage-Max |
3750 V
|
5300 V
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.008 A
|
0.008 A
|
| Operating Temperature-Max |
70 °C
|
100 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Optoelectronic Device Type |
LOGIC IC OUTPUT OPTOCOUPLER
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Base Number Matches |
4
|
5
|
| Current Transfer Ratio-Min |
|
5%
|
| Forward Voltage-Max |
|
1.9 V
|
| Mounting Feature |
|
THROUGH HOLE MOUNT
|
| Power Dissipation-Max |
|
0.1 W
|
| Surface Mount |
|
NO
|
|
|
|
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