HCPL-7825
vs
ISO130U
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HEWLETT PACKARD CO
BURR-BROWN CORP
Part Package Code
DIP
Package Description
,
SOP, SOP8,.4
Pin Count
8
Reach Compliance Code
unknown
unknown
Category CO2 Kg
12.04
12.04
Amplifier Type
ISOLATION AMPLIFIER
ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom
200 MHz
85 MHz
Common Mode Voltage-Max
3750 V
3750 V
Isolation Voltage-Min
3750 V
3750 V
JESD-30 Code
R-PDIP-T8
R-PDSO-G8
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
HYBRID
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Voltage Gain-Max
8.56
8.4
Voltage Gain-Min
7.44
7.61
Base Number Matches
1
2
Rohs Code
Compliance Temperature Grade
Industrial: -40C to +85C
JESD-609 Code
e0
Package Code
SOP
Package Equivalence Code
SOP8,.4
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
Compare HCPL-7825 with alternatives
Compare ISO130U with alternatives