HCPL-7800
vs
HCPL-7850100
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
AGILENT TECHNOLOGIES INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
SOI,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
85 MHz
|
100 MHz
|
| Common Mode Voltage-Max |
3750 V
|
|
| Isolation Voltage-Min |
3750 V
|
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-B8
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOI
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
BUTT
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Max |
8.4
|
8.4
|
| Voltage Gain-Min |
7.61
|
7.6
|
| Base Number Matches |
15
|
2
|
| Length |
|
9.655 mm
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
4.32 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
Compare HCPL-7800 with alternatives
Compare HCPL-7850100 with alternatives