HCF4068BEY
vs
MC14068BALD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
JESD-609 Code
e3
e0
Load Capacitance (CL)
50 pF
Logic IC Type
AND/NAND GATE
NAND GATE
Max I(ol)
0.00035999999999999997 A
Number of Functions
1
Number of Inputs
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
300 ns
Propagation Delay (tpd)
300 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.1 mm
Supply Voltage-Max (Vsup)
20 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Power Supplies
5/15 V
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