HCF40105BF
vs
CD40105BD
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
HARRIS SEMICONDUCTOR
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Clock Frequency-Max (fCLK) |
3 MHz
|
1.5 MHz
|
JESD-30 Code |
R-XDIP-T16
|
R-XDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
Memory Width |
4
|
4
|
Number of Terminals |
16
|
16
|
Number of Words |
16 words
|
16 words
|
Number of Words Code |
16
|
16
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
16X4
|
16X4
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
4
|
Package Description |
|
DIP-16
|
|
|
|
Compare HCF40105BF with alternatives
Compare CD40105BD with alternatives