HCC4514BF vs MC14514BCP feature comparison

HCC4514BF STMicroelectronics

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MC14514BCP Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP24,.6 DIP,
Pin Count 24 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES ADDRESS LATCHES
Family 4000/14000/40000 4000/14000/40000
Input Conditioning LATCHED
JESD-30 Code R-GDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER OTHER DECODER/DRIVER
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 970 ns
Propagation Delay (tpd) 970 ns 800 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.71 mm 5.08 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 6
Length 31.75 mm

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