HC55185FCM vs HC55171IB feature comparison

HC55185FCM Rochester Electronics LLC

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HC55171IB Intersil Corporation

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC INTERSIL CORP
Part Package Code LCC SOIC
Package Description PLASTIC, MS-018AB, LCC-28 SOIC-28
Pin Count 28 28
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQCC-J28 R-PDSO-G28
JESD-609 Code e0 e0
Length 11.505 mm 17.9 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ SOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 2.65 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Telecom IC Type SLIC SLIC
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD DUAL
Width 11.505 mm 7.5 mm
Base Number Matches 2 3
Battery Feed RESISTIVE
Battery Supply -24 V
Hybrid 2-4 CONVERSION
PSRR-Min 33 dB
Package Equivalence Code SOP28,.4
Supply Current-Max 0.006 mA

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