HC55171IB
vs
HC55171CM96
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SOIC-28
|
PLASTIC, LCC-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Battery Feed |
RESISTIVE
|
RESISTIVE
|
Battery Supply |
-24 V
|
-24 V
|
Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
JESD-30 Code |
R-PDSO-G28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
17.9 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
|
PSRR-Min |
33 dB
|
33 dB
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP28,.4
|
LDCC28,.5SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
|
Supply Current-Max |
0.006 mA
|
0.006 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
7.5 mm
|
|
Base Number Matches |
3
|
3
|
|
|
|
Compare HC55171IB with alternatives
Compare HC55171CM96 with alternatives