HB56S864ESN-6
vs
MT8LSDT864AG-10CXX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
HITACHI LTD
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
DIMM
|
|
| Package Description |
DIMM, DIMM168
|
,
|
| Pin Count |
168
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Access Mode |
FAST PAGE WITH EDO
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
60 ns
|
6 ns
|
| Additional Feature |
RAS ONLY/CAS BEFORE RAS REFRESH
|
AUTO/SELF REFRESH
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
| Memory Density |
536870912 bit
|
536870912 bit
|
| Memory IC Type |
EDO DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
| Memory Width |
64
|
64
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
168
|
168
|
| Number of Words |
8388608 words
|
8388608 words
|
| Number of Words Code |
8000000
|
8000000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8MX64
|
8MX64
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIMM
|
|
| Package Equivalence Code |
DIMM168
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
4096
|
|
| Seated Height-Max |
25.4 mm
|
|
| Standby Current-Max |
0.032 A
|
|
| Supply Current-Max |
1.36 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Self Refresh |
|
YES
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HB56S864ESN-6 with alternatives
Compare MT8LSDT864AG-10CXX with alternatives