HB56D836SBR-6AC
vs
M53640810CW0-C50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
SIMM
SIMM
Package Description
,
,
Pin Count
72
72
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FAST PAGE
FAST PAGE WITH EDO
Access Time-Max
60 ns
50 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Alternate Memory Width
18
JESD-30 Code
R-XSMA-N72
R-XSMA-N72
Memory Density
301989888 bit
301989888 bit
Memory IC Type
FAST PAGE DRAM MODULE
EDO DRAM MODULE
Memory Width
36
36
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
72
72
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX36
8MX36
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
SIMM
SIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
2048
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Compare HB56D836SBR-6AC with alternatives
Compare M53640810CW0-C50 with alternatives