H2512CPG8252F30-TR
vs
S2512CPC8252F30-TR
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e4
e4
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.58 mm
0.58 mm
Package Length
6.35 mm
6.35 mm
Package Style
SMT
SMT
Package Width
3.02 mm
3.02 mm
Packing Method
TR
TR
Rated Power Dissipation (P)
1.5 W
1.5 W
Resistance
82500 Ω
82500 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2512
2512
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Gold (Au)
Silver (Ag)
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Pbfree Code
Yes
Package Description
CHIP, ROHS COMPLIANT
HTS Code
8533.21.00.30
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare H2512CPG8252F30-TR with alternatives
Compare S2512CPC8252F30-TR with alternatives