H1264B-55Y[PWRDOWN]
vs
M27HC641-35XFS1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HUGHES AIRCRAFT
STMICROELECTRONICS
Package Description
,
0.300 INCH, FRIT SEALED, WINDOWED, CERAMIC, DIP-24
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
150 ns
35 ns
Additional Feature
STATIC CMOS
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
16777216 bit
65536 bit
Memory IC Type
MASK ROM
UVPROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1MX16
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
0.05 mA
0.06 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
24
I/O Type
COMMON
JESD-609 Code
e0
Package Equivalence Code
DIP24,.3
Standby Current-Max
0.02 A
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare H1264B-55Y[PWRDOWN] with alternatives
Compare M27HC641-35XFS1 with alternatives