H11F1G
vs
H11F1TVM
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ISOCOM COMPONENTS LTD
|
ONSEMI
|
| Package Description |
PLASTIC, DIP-6
|
DIP-6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Additional Feature |
UL RECOGNIZED
|
UL RECOGNIZED, VDE APPROVED
|
| Coll-Emtr Bkdn Voltage-Min |
30 V
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Dark Current-Max |
50 nA
|
|
| Forward Current-Max |
0.06 A
|
0.06 A
|
| Isolation Voltage-Max |
5300 V
|
7500 V
|
| JESD-609 Code |
e0
|
e3
|
| Number of Elements |
1
|
1
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Optoelectronic Device Type |
FET OUTPUT OPTOCOUPLER
|
FET OUTPUT OPTOCOUPLER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Matte Tin (Sn) - annealed
|
| Base Number Matches |
1
|
1
|
| Manufacturer Package Code |
|
646BZ
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Forward Voltage-Max |
|
1.75 V
|
| Mounting Feature |
|
THROUGH HOLE MOUNT
|
| On-State Current-Max |
|
1 A
|
| Power Dissipation-Max |
|
0.1 W
|
| Response Time-Max |
|
0.000025 s
|
| Surface Mount |
|
NO
|
|
|
|
Compare H11F1G with alternatives
Compare H11F1TVM with alternatives