GTLPH16612DGG-T
vs
CD74HC652H
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
HARRIS SEMICONDUCTOR
Part Package Code
TSSOP
Package Description
TSSOP,
DIE,
Pin Count
56
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
GTLP
HC/UH
JESD-30 Code
R-PDSO-G56
X-XUUC-N24
Length
14 mm
Logic IC Type
REGISTERED BUS TRANSCEIVER
REGISTERED BUS TRANSCEIVER
Number of Bits
18
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
56
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Propagation Delay (tpd)
4.9 ns
55 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
3 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
BICMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
DUAL
UPPER
Width
6.1 mm
Base Number Matches
1
2
Additional Feature
SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIE OR CHIP
Compare GTLPH16612DGG-T with alternatives
Compare CD74HC652H with alternatives