GTL2012DC,125 vs GTL2012DC feature comparison

GTL2012DC,125 NXP Semiconductors

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GTL2012DC NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP TSSOP
Package Description 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 VSSOP, TSSOP8,.12,20
Pin Count 8 8
Manufacturer Package Code SOT765-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Interface IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 2.3 mm 2.3 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 2 mm
Base Number Matches 1 2
Rohs Code Yes

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Compare GTL2012DC with alternatives