GS88218CB-300M
vs
CY7C1360B-225AC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
GSI TECHNOLOGY
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA,
|
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
|
| Pin Count |
119
|
100
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.B
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Factory Lead Time |
24 Weeks
|
|
| Access Time-Max |
5 ns
|
2.8 ns
|
| Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY
|
PIPELINED ARCHITECTURE
|
| JESD-30 Code |
R-PBGA-B119
|
R-PQFP-G100
|
| Length |
22 mm
|
20 mm
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
| Memory Width |
18
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
119
|
100
|
| Number of Words |
524288 words
|
262144 words
|
| Number of Words Code |
512000
|
256000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
512KX18
|
256KX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LQFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.99 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
14 mm
|
14 mm
|
| Base Number Matches |
2
|
1
|
| Clock Frequency-Max (fCLK) |
|
225 MHz
|
| I/O Type |
|
COMMON
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Output Characteristics |
|
3-STATE
|
| Package Equivalence Code |
|
QFP100,.63X.87
|
| Standby Current-Max |
|
0.03 A
|
| Standby Voltage-Min |
|
3.14 V
|
| Supply Current-Max |
|
0.25 mA
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare GS88218CB-300M with alternatives
Compare CY7C1360B-225AC with alternatives