CY7C1360B-225AC
vs
UPD4381322GF-A75
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
QFP
Package Description
14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Pin Count
100
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
2.8 ns
4.2 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
225 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e0
Length
20 mm
Memory Density
9437184 bit
8388608 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
36
32
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX36
256KX32
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Equivalence Code
QFP100,.63X.87
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
Standby Current-Max
0.03 A
0.01 A
Standby Voltage-Min
3.14 V
3.14 V
Supply Current-Max
0.25 mA
0.4 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
14 mm
Base Number Matches
1
2
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