GS8662D19BD-300I vs GS81302D06GE-500 feature comparison

GS8662D19BD-300I GSI Technology

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GS81302D06GE-500 GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks 24 Weeks
Access Time-Max 0.45 ns 0.37 ns
Additional Feature PIPELINE ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 17 mm
Memory Density 75497472 bit 134217728 bit
Memory IC Type DDR SRAM QDR II PLUS SRAM
Memory Width 18 8
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 4194304 words 16777216 words
Number of Words Code 4000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX18 16MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 13 mm 15 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3

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