GS81302D06GE-500 vs IS61DDPB44M18A-550B4I feature comparison

GS81302D06GE-500 GSI Technology

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IS61DDPB44M18A-550B4I Integrated Silicon Solution Inc

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.37 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1
Length 17 mm 15 mm
Memory Density 134217728 bit 75497472 bit
Memory IC Type QDR II PLUS SRAM DDR SRAM
Memory Width 8 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 16777216 words 4194304 words
Number of Words Code 16000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16MX8 4MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.9 V 1.89 V
Supply Voltage-Min (Vsup) 1.7 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm 13 mm
Base Number Matches 1 1
Temperature Grade INDUSTRIAL

Compare GS81302D06GE-500 with alternatives

Compare IS61DDPB44M18A-550B4I with alternatives