GS8640FZ36T-6.5V
vs
CY7C1471V33-100BZXI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
LBGA,
Pin Count
100
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
8.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
FLOW-THROUGH ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
Length
20 mm
17 mm
Memory Density
75497472 bit
75497472 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.4 mm
Supply Voltage-Max (Vsup)
2 V
3.63 V
Supply Voltage-Min (Vsup)
1.7 V
3.135 V
Supply Voltage-Nom (Vsup)
1.8 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
14 mm
15 mm
Base Number Matches
1
1
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Compare GS8640FZ36T-6.5V with alternatives
Compare CY7C1471V33-100BZXI with alternatives