GS832272C-225M
vs
GS8330DW72C-200I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA, BGA209,11X19,40
BGA,
Pin Count
209
209
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Samacsys Manufacturer
GSI TECHNOLOGY
Access Time-Max
7 ns
2.25 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
225 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
Length
22 mm
22 mm
Memory Density
37748736 bit
37748736 bit
Memory IC Type
CACHE SRAM
STANDARD SRAM
Memory Width
72
72
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX72
512KX72
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
Standby Current-Max
0.2 A
Standby Voltage-Min
2.3 V
Supply Current-Max
0.39 mA
Supply Voltage-Max (Vsup)
2.7 V
1.95 V
Supply Voltage-Min (Vsup)
2.3 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
2
2
Pbfree Code
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
220
Compare GS832272C-225M with alternatives
Compare GS8330DW72C-200I with alternatives