GS832272C-225M vs GS832472GC-250 feature comparison

GS832272C-225M GSI Technology

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GS832472GC-250 GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, BGA209,11X19,40 LBGA,
Pin Count 209 209
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 7 ns 6 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT ALSO OPERATES AT AS 3.3V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
Clock Frequency-Max (fCLK) 225 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 72 72
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512KX72 512KX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Standby Current-Max 0.2 A
Standby Voltage-Min 2.3 V
Supply Current-Max 0.39 mA
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN SILVER COPPER

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