GS8321Z32AD-333I
vs
GS8321Z32AGD-333I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Samacsys Manufacturer
GSI TECHNOLOGY
Access Time-Max
4.5 ns
4.5 ns
Additional Feature
IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE
IT ALSO OPERATES AT 3 V TO 3.6 V SUPPLY VOLTAGE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX32
1MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare GS8321Z32AD-333I with alternatives
Compare GS8321Z32AGD-333I with alternatives