GS8170DW36GC-300I
vs
CXK79M36C165GB-33
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
SONY CORP
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1 MM PITCH, BGA-209
BGA, BGA209,11X19,40
Pin Count
209
209
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1.8 ns
2 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE; LATE WRITE
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
36
36
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX36
512KX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.3 mm
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.75 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
303 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA209,11X19,40
Standby Voltage-Min
1.75 V
Supply Current-Max
0.58 mA
Compare GS8170DW36GC-300I with alternatives
Compare CXK79M36C165GB-33 with alternatives