Part Details for GS8170DW36GC-300I by GSI Technology
Overview of GS8170DW36GC-300I by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| EL8300IUZ | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Tube | |
| ISL68300IRAZ-TK | Renesas Electronics Corporation | Scalable Single Output Digital PWM Controller with Integrated Driver and PMBus | |
| EL8300IU-T13 | Renesas Electronics Corporation | 200MHz Rail-to-Rail Amplifier, QSOP, /Reel |
Part Details for GS8170DW36GC-300I
GS8170DW36GC-300I CAD Models
GS8170DW36GC-300I Part Data Attributes
|
|
GS8170DW36GC-300I
GSI Technology
Buy Now
Datasheet
|
Compare Parts:
GS8170DW36GC-300I
GSI Technology
Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | 14 X 22 MM, 1 MM PITCH, BGA-209 | |
| Pin Count | 209 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 1.8 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B209 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 209 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX36 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for GS8170DW36GC-300I
This table gives cross-reference parts and alternative options found for GS8170DW36GC-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8170DW36GC-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8170DW36GC-300 | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170DW36GC-300I vs GS8170DW36GC-300 |
| GS8170DW36C-300IT | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170DW36GC-300I vs GS8170DW36C-300IT |
| GS8170DW36GC-300T | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | GS8170DW36GC-300I vs GS8170DW36GC-300T |