GS8170D18B-333T
vs
CXK79M18C163GB-4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
SONY CORP
Part Package Code
BGA
BGA
Package Description
LBGA, BGA209,11X19,40
BGA, BGA209,11X19,40
Pin Count
209
209
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1.6 ns
2.1 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
Organization
1MX18
1MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA209,11X19,40
BGA209,11X19,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.3 mm
Standby Voltage-Min
1.7 V
1.7 V
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
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