GS8162Z18DD-250V vs IS61VF51236A-7.5TQVI feature comparison

GS8162Z18DD-250V GSI Technology

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IS61VF51236A-7.5TQVI Integrated Silicon Solution Inc

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY INTEGRATED SILICON SOLUTION INC
Part Package Code BGA QFP
Package Description LBGA, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100
Pin Count 165 100
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 5.5 ns 7.5 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY PIPELINED ARCHITECTURE, FLOW-THROUGH
JESD-30 Code R-PBGA-B165 R-PQFP-F100
Length 15 mm 20 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 18 36
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 1048576 words 524288 words
Number of Words Code 1000000 512000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18 512KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA QFF
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.6 mm
Supply Voltage-Max (Vsup) 2 V 2.625 V
Supply Voltage-Min (Vsup) 1.7 V 2.375 V
Supply Voltage-Nom (Vsup) 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL FLAT
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 14 mm
Base Number Matches 1 1

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Compare IS61VF51236A-7.5TQVI with alternatives